Invention Grant
- Patent Title: Method of assembly of first and second component
- Patent Title (中): 第一和第二部件的组装方法
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Application No.: US09853334Application Date: 2001-05-11
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Publication No.: US06718613B2Publication Date: 2004-04-13
- Inventor: Nigel Spurr
- Applicant: Nigel Spurr
- Priority: GB0011460 20000513
- Main IPC: B21D3900
- IPC: B21D3900

Abstract:
A method of assembly of a first and second component comprising the steps of providing the first component with a projection providing a second component with a plastics engagement surface assembling the first and second components such that the projection is held substantially rigid relative to the first component and the plastics engagement surface is plastically deformed around the projection then allowing the plastics engagement surface to further creep around the projection such that the force required to disassemble the first and second components increases.
Public/Granted literature
- US20010054222A1 Method of assembly of first and second component Public/Granted day:2001-12-27
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