发明授权
US06722553B2 Controlled and programmed deposition of flux on a flip-chip die by spraying
失效
通过喷涂控制并编程在倒装芯片上沉积助焊剂
- 专利标题： Controlled and programmed deposition of flux on a flip-chip die by spraying
- 专利标题（中）： 通过喷涂控制并编程在倒装芯片上沉积助焊剂
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申请号： US09922936申请日： 2001-08-07
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公开(公告)号： US06722553B2公开(公告)日： 2004-04-20
- 发明人: Raj N. Master , Mohammad Z. Khan , Maria G. Guardado , Ooi Tong Ong
- 申请人： Raj N. Master , Mohammad Z. Khan , Maria G. Guardado , Ooi Tong Ong
- 主分类号： B23K1308
- IPC分类号： B23K1308
摘要：
A method and apparatus are provided for controllably dispensing flux on a substrate having a plurality of conductive terminals. Flux having a viscosity range between 10 centipoises and about 150 centipoises is sprayed on the substrate and the conductive terminals at a valve pressure range between about 1.5 psi and about 30 psi via a dispense nozzle of a flux dispenser. Upon a subsequent high temperature solder reflow process, the sprayed flux on the substrate is mostly removed by thermal decomposition to volatile species, thereby significantly reducing flux residue remaining on the surface of the substrate between the conductive terminals.