发明授权
- 专利标题: Robot blade with dual offset wafer supports
- 专利标题(中): 具有双偏移晶片支架的机器人刀片
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申请号: US08946920申请日: 1997-10-08
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公开(公告)号: US06722834B1公开(公告)日: 2004-04-20
- 发明人: Avi Tepman
- 申请人: Avi Tepman
- 主分类号: B44C122
- IPC分类号: B44C122
摘要:
A robot blade and a method of using the robot blade for transferring objects, namely substrates, through a process system, the robot blade comprising an upper platform having a first object supporting surface and a lower platform having a second object supporting surface. The robot blade is mounted onto a moveable member, and the assembly facilitates substrate transfers, such as removal of a processed substrate and insertion of an unprocessed substrate within a processing chamber through a single entry of the robot blade into the processing chamber.
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