发明授权
US06722834B1 Robot blade with dual offset wafer supports 失效
具有双偏移晶片支架的机器人刀片

  • 专利标题: Robot blade with dual offset wafer supports
  • 专利标题(中): 具有双偏移晶片支架的机器人刀片
  • 申请号: US08946920
    申请日: 1997-10-08
  • 公开(公告)号: US06722834B1
    公开(公告)日: 2004-04-20
  • 发明人: Avi Tepman
  • 申请人: Avi Tepman
  • 主分类号: B44C122
  • IPC分类号: B44C122
Robot blade with dual offset wafer supports
摘要:
A robot blade and a method of using the robot blade for transferring objects, namely substrates, through a process system, the robot blade comprising an upper platform having a first object supporting surface and a lower platform having a second object supporting surface. The robot blade is mounted onto a moveable member, and the assembly facilitates substrate transfers, such as removal of a processed substrate and insertion of an unprocessed substrate within a processing chamber through a single entry of the robot blade into the processing chamber.
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