A lamination method, which is a method in which a dry resist film, formed by providing a color resist layer on a base film, is cut based upon the length of a substrate in the feeding direction, and press-bonded onto the substrate, and then the color resist layer is transferred onto the substrate by separating the base film, is provided with the following steps: in the cutting process, cutting the film so that the rear end of the dry resist film, after the press-bonding, extrudes from the rear end of the substrate by a predetermined width; and cutting the dry resist film again at a position inside the rear end of the substrate prior to separating the base film after the dry resist film has been press-bonded so as to eliminate the portion of the dry resist film extruding from the substrate.