Invention Grant
- Patent Title: Laser cutting apparatus and method
- Patent Title (中): 激光切割装置及方法
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Application No.: US10445852Application Date: 2003-05-28
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Publication No.: US06723952B2Publication Date: 2004-04-20
- Inventor: Dae-ho Choo , Byeong-ill Kim , Sung-uk Jung , Woo-shik Lee , Bum-soo Kim
- Applicant: Dae-ho Choo , Byeong-ill Kim , Sung-uk Jung , Woo-shik Lee , Bum-soo Kim
- Priority: KR1998/34606 19980826; KR1998/45429 19981028; KR1998/53538 19981204; KR1998/53539 19981204; KR1998/53541 19981204
- Main IPC: B23K2638
- IPC: B23K2638

Abstract:
The present invention disclose a laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam. The laser cutter includes a laser unit for irradiating a laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for forming a pre-cut groove at starting edge of the marked cutting line, and a cooling unit for cooling the cutting line which said laser beam has been irradiated.
Public/Granted literature
- US20030209528A1 Laser cutting apparatus and method Public/Granted day:2003-11-13
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