Invention Grant
- Patent Title: Heat dissipation device
- Patent Title (中): 散热装置
-
Application No.: US10281244Application Date: 2002-10-28
-
Publication No.: US06725906B2Publication Date: 2004-04-27
- Inventor: Tsu-Liang Lin , Bor Haw Chang , Yu-Hung Huang , Wen-Shi Huang
- Applicant: Tsu-Liang Lin , Bor Haw Chang , Yu-Hung Huang , Wen-Shi Huang
- Priority: TW90212056U 20010717
- Main IPC: F28F700
- IPC: F28F700

Abstract:
The present heat dissipation device is provided with a fan frame and a blade structure. The fan frame includes an air inlet, an air outlet, and a curved portion. The air inlet has a non-circular indentation in the vicinity of the curved portion corresponding to the airflow passage. This indentation effectively increases the airflow amount and static pressure of the airflow expelled from the heat dissipation device.
Public/Granted literature
- US20030066627A1 Heat dissipation device Public/Granted day:2003-04-10
Information query