发明授权
- 专利标题: Batch type heat treatment system, method for controlling same, and heat treatment method
- 专利标题(中): 批式热处理系统,其控制方法和热处理方法
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申请号: US09897908申请日: 2001-07-05
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公开(公告)号: US06730885B2公开(公告)日: 2004-05-04
- 发明人: Fujio Suzuki , Wenling Wang , Koichi Sakamoto , Moyuru Yasuhara , Sunil Shah , Pradeep Pandey
- 申请人: Fujio Suzuki , Wenling Wang , Koichi Sakamoto , Moyuru Yasuhara , Sunil Shah , Pradeep Pandey
- 优先权: JP2000-204592 20000706
- 主分类号: H05B302
- IPC分类号: H05B302
摘要:
There is provided a batch type heat treatment system, control method and heat treatment method capable of appropriately coping with a multi-product small-lot production. A reaction tube 2 comprises a plurality of heaters 31 through 35 and a plurality of temperature sensors, and houses therein a wafer boat 23. A control part 100 stores therein many mathematical models for estimating (calculating) the temperature of wafers W in the reaction tube 2, in accordance with the number and arranged position of the wafers W mounted on the wafer boat 23, and many target temperature trajectories. If the wafer boat 23 is loaded in the reaction tube 2, a mathematical model and a target temperature trajectory corresponding to the number and arranged position of the mounted wafers W are read. If a deposition process is started, the output of a temperature sensor S and the model are used for estimating the temperature of the wafers W in the reaction tube 2, and the powers to be supplied to the heaters 31 through 35 are separately controlled so that the estimated temperature approaches the target temperature trajectory.
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