发明授权
- 专利标题: Hybrid integrated circuit device
- 专利标题(中): 混合集成电路器件
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申请号: US09536898申请日: 2000-03-28
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公开(公告)号: US06730933B1公开(公告)日: 2004-05-04
- 发明人: Hisashi Shimizu , Noriaki Sakamoto , Yoshiyuki Kobayashi
- 申请人: Hisashi Shimizu , Noriaki Sakamoto , Yoshiyuki Kobayashi
- 优先权: JPP.11-238413 19990825
- 主分类号: H01L2715
- IPC分类号: H01L2715
摘要:
In a light irradiation device in which a light emitting element is attached to a printed circuit board, the heat radiation properties are enhanced, and improvement of the light emitting efficiency, reduction of the size and weight, and prevention of temporal changes are realized. A Cu pattern covered with Ni is formed on a metal substrate 11. Light emitting elements 11 are mounted on the pattern in the form of a series circuit. Metal substrates in each of which the series connection is formed are connected to one another in parallel. Since Ni has excellent corrosion resistance and a high reflection efficiency, the surfaces of the substrates themselves can be used as reflective plates. A lens 37 is formed for each of the light emitting elements, whereby the emission efficiency can be further improved. A transparent substrate 50 is bonded via a seal 51, and temporal changes of a light emitting element 10 and electrodes which are sealed therein are suppressed.