发明授权
US06737107B2 Nonoparticles formed with rigid connector compounds 有权
用刚性连接剂化合物形成的非颗粒

Nonoparticles formed with rigid connector compounds
摘要:
The present invention relates to a novel organosilicon particle having the formula SiaObCcHd. The particle may be coated with an organic film, preferably a rigid connector compound. The present invention also provides a method of using the organosilicon particle and/or rigid connector compound in the formation of a low-k dielectric film.
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