发明授权
US06737680B2 Method and apparatus for fabricating a photocoupler with reduced mount area
失效
用于制造具有减小的安装面积的光电耦合器的方法和装置
- 专利标题: Method and apparatus for fabricating a photocoupler with reduced mount area
- 专利标题(中): 用于制造具有减小的安装面积的光电耦合器的方法和装置
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申请号: US10144784申请日: 2002-05-15
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公开(公告)号: US06737680B2公开(公告)日: 2004-05-18
- 发明人: Yasushi Hasegawa
- 申请人: Yasushi Hasegawa
- 优先权: JPP2001-145146 20010515
- 主分类号: H01L2715
- IPC分类号: H01L2715
摘要:
The present invention provides a photocoupler capable of reducing the mount area required to mount the photocoupler on an object by eliminating a structurally unnecessary portion, and an apparatus and method for fabricating such a photocoupler. A light-receiving device and a light-emitting device placed on a pair of lead frames are embedded in a primary mold body made of a transparent resin, and the primary mold body is embedded in a secondary mold body made of a light-shading resin, to form the photocoupler. The lead frames are bent inside the secondary mold body, and the outer side of the terminal portion of each lead frame, ranging from the bent position to the top end, is exposed at the secondary mold body.
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