Invention Grant
US06737710B2 Transistor structure having silicide source/drain extensions 有权
具有硅化物源极/漏极延伸部的晶体管结构

  • Patent Title: Transistor structure having silicide source/drain extensions
  • Patent Title (中): 具有硅化物源极/漏极延伸部的晶体管结构
  • Application No.: US09343293
    Application Date: 1999-06-30
  • Publication No.: US06737710B2
    Publication Date: 2004-05-18
  • Inventor: Peng ChengBrian DoyleGang Bai
  • Applicant: Peng ChengBrian DoyleGang Bai
  • Main IPC: H01L2976
  • IPC: H01L2976
Transistor structure having silicide source/drain extensions
Abstract:
A MOSFET includes a double silicided source/drain structure wherein the source/drain terminals include a silicided source/drain extension, a deep silicided source/drain region, and a doped semiconductor portion that surrounds a portion of the source/drain structure such that the suicides are isolated from the MOSFET body node. In a further aspect of the present invention, a barrier layer is formed around a gate electrode to prevent electrical shorts between a silicided source/drain extension and the gate electrode. A deep source/drain is then formed, self-aligned to sidewall spacers that are formed subsequent to the silicidation of the source/drain extension.
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