Invention Grant
- Patent Title: Transistor structure having silicide source/drain extensions
- Patent Title (中): 具有硅化物源极/漏极延伸部的晶体管结构
-
Application No.: US09343293Application Date: 1999-06-30
-
Publication No.: US06737710B2Publication Date: 2004-05-18
- Inventor: Peng Cheng , Brian Doyle , Gang Bai
- Applicant: Peng Cheng , Brian Doyle , Gang Bai
- Main IPC: H01L2976
- IPC: H01L2976

Abstract:
A MOSFET includes a double silicided source/drain structure wherein the source/drain terminals include a silicided source/drain extension, a deep silicided source/drain region, and a doped semiconductor portion that surrounds a portion of the source/drain structure such that the suicides are isolated from the MOSFET body node. In a further aspect of the present invention, a barrier layer is formed around a gate electrode to prevent electrical shorts between a silicided source/drain extension and the gate electrode. A deep source/drain is then formed, self-aligned to sidewall spacers that are formed subsequent to the silicidation of the source/drain extension.
Public/Granted literature
- US20020086505A1 TRANSISTOR STRUCTURE HAVING SILICIDE SOURE/DRAIN EXTENSIONS Public/Granted day:2002-07-04
Information query