In an LOC semiconductor device, a semiconductor chip is fixed on a die pad through a die pad material. A lead including an internal lead extending to the vicinity of a pad provided to the semiconductor chip is put in place. A tape member is placed at positions corresponding to four corners of the semiconductor chip between the internal lead and the semiconductor chip. The tape member is bonded and fixed only to the internal lead but it is not bonded or fixed to the semiconductor chip and merely contacts the surface of the semiconductor chip.