Invention Grant
- Patent Title: Micromechanical device and method of manufacture thereof
- Patent Title (中): 微机械装置及其制造方法
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Application No.: US10230200Application Date: 2002-08-29
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Publication No.: US06740946B2Publication Date: 2004-05-25
- Inventor: Hideyuki Funaki
- Applicant: Hideyuki Funaki
- Priority: JP2001-261999 20010830
- Main IPC: H01L2982
- IPC: H01L2982

Abstract:
A micromechanical switch includes a substrate, at least one pair of support members fixed to the substrate, and at least one pair of beam members placed in proximity and parallel to each other above the substrate, and connected to one of the support members, respectively, each of the beam members having a moving portion which is movable with a gap with respect to the substrate. A contact portion is provided on the moving portion, and a driving electrode is placed on the substrate between the pair of beam members to attract the moving portions of the beam members in a direction in a plane substantially parallel to the substrate with an electrostatic force so that the contact portions of the bean members which are opposed to each other are short-circuited.
Public/Granted literature
- US20030042561A1 Micromechanical device and method of manufacture thereof Public/Granted day:2003-03-06
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