发明授权
US06745464B2 Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board
失效
可拆卸膜，具有膜的基板，用于形成可移除膜的工艺以及用于制造电路板的工艺
- 专利标题： Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board
- 专利标题（中）： 可拆卸膜，具有膜的基板，用于形成可移除膜的工艺以及用于制造电路板的工艺
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申请号： US10401607申请日： 2003-03-31
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公开(公告)号： US06745464B2公开(公告)日： 2004-06-08
- 发明人: Fumio Echigo , Hideki Higashitani , Daizo Andoh , Noritake Fukuda , Yasuhiro Nakatani , Tadashi Nakamura
- 申请人： Fumio Echigo , Hideki Higashitani , Daizo Andoh , Noritake Fukuda , Yasuhiro Nakatani , Tadashi Nakamura
- 优先权： JPP11-357063 19991216; JPP2000-66858 20000310
- 主分类号： H01K310
- IPC分类号： H01K310
摘要：
Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and fine through holes 306 are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.
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