发明授权
- 专利标题: Backlight module structure
- 专利标题(中): 背光模块结构
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申请号: US10191566申请日: 2002-07-10
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公开(公告)号: US06752507B2公开(公告)日: 2004-06-22
- 发明人: Chih-Yuan Wang , Kuo Jui Huang
- 申请人: Chih-Yuan Wang , Kuo Jui Huang
- 主分类号: F21V704
- IPC分类号: F21V704
摘要:
A backlight module structure is including a photoconductive element. The top of the photoconductive element has an outgoing face formed with numerous microstructures. An optical transforming layer is overlaid on the outgoing face of the photoconductive element between the outgoing face and the liquid crystal module. A solid powder material is mixed with a polymer binder and adhered to a transparent substrate to form the optical transforming layer. The solid powder material includes at least a lighting material.
公开/授权文献
- US20040008504A1 Backlight module structure 公开/授权日:2004-01-15
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