发明授权
- 专利标题: Methods for fabricating semiconductor devices having capacitors
- 专利标题(中): 制造具有电容器的半导体器件的方法
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申请号: US10322274申请日: 2002-12-17
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公开(公告)号: US06753221B2公开(公告)日: 2004-06-22
- 发明人: Jeong-Sic Jeon , Chang-Jin Kang , Seung-Young Son , Jin-Hong Kim
- 申请人: Jeong-Sic Jeon , Chang-Jin Kang , Seung-Young Son , Jin-Hong Kim
- 优先权: KR2001-85991 20011227
- 主分类号: H01L218242
- IPC分类号: H01L218242
摘要:
Methods for fabricating semiconductor devices having capacitors are provided. A plurality of storage node electrodes are formed on a semiconductor substrate. Then, a capacitor dielectric layer is formed over the storage node electrodes. A plate electrode layer is subsequently formed on the capacitor dielectric layer. A hard mask layer is then formed on the resultant structure where the plate electrode layer is formed so as to fill a gap between the adjacent storage node electrodes. The hard mask layer and the plate electrode layer are successively patterned to form a plate electrode.
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