发明授权
- 专利标题: Apparatus for making a heat-sensitive stencil
- 专利标题(中): 用于制作热敏模板的装置
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申请号: US10448233申请日: 2003-05-30
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公开(公告)号: US06755126B2公开(公告)日: 2004-06-29
- 发明人: Jun Nakamura , Kenji Ohshima
- 申请人: Jun Nakamura , Kenji Ohshima
- 优先权: JP2000-145776 20000517
- 主分类号: B41C114
- IPC分类号: B41C114
摘要:
A stencil is made by thermally forming perforations arranged in both a main scanning direction and a sub-scanning direction in a thermoplastic resin film of heat-sensitive stencil material by the use of a heat source which is heated through supply of energy. Supply of energy to the heat source is cut when a time interval not shorter than 50% and not longer than 100% of an estimated perforating time lapses from the time at which supply of energy to the heat source is started. The estimated perforating time is a time interval expected to be necessary for a perforation to be produced by the heat of the heat source and to be enlarged to a desired size as a final size as measured from the time at which supply of energy to the heat source is started.
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