- 专利标题: Interconnect structure
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申请号: US10060880申请日: 2002-01-29
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公开(公告)号: US06756244B2公开(公告)日: 2004-06-29
- 发明人: John Liebeskind
- 申请人: John Liebeskind
- 主分类号: H01L2166
- IPC分类号: H01L2166
摘要:
An interconnect structure including a substrate, an interconnect device formed on the substrate, and a test device formed on the substrate.
公开/授权文献
- US20030143762A1 Interconnect structure 公开/授权日:2003-07-31