A method of making a microelectronic device providing a base substrate having a bond pad, a first passivation layer overlying the base substrate and a portion of the bond pad, and a second passivation layer overlying the first passivation layer; forming a first sacrificial layer over the second passivation layer, wherein the first sacrificial layer includes an opening therethrough; etching the exposed portion of the second passivation layer to provide a recess therein; trimming a portion of the first sacrificial layer to enlarge the opening; etching the exposed portion of the second passivation layer to provide an enlarged recess and a first riser, a second tread, a second riser and a second tread; removing the first sacrificial layer; depositing a redistribution layer into the enlarged recess in the second passivation layer and over the first riser, first tread, second riser, and second tread.