发明授权
- 专利标题: Semiconductor device
- 专利标题(中): 半导体器件
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申请号: US10224342申请日: 2002-08-21
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公开(公告)号: US06756686B2公开(公告)日: 2004-06-29
- 发明人: Toshihiro Iwasaki , Keiichiro Wakamiya , Michitaka Kimura , Yasumichi Hatanaka
- 申请人: Toshihiro Iwasaki , Keiichiro Wakamiya , Michitaka Kimura , Yasumichi Hatanaka
- 优先权: JP2001-296333 20010927
- 主分类号: H01L2348
- IPC分类号: H01L2348
摘要:
A semiconductor device includes a first substrate, a second substrate, a plurality of conductors, and supporting members. The first substrate has a plurality of electrode portions disposed on one side thereof. The second substrate has a plurality of electrode portions disposed on one side thereof. The conductors are for connecting the plurality of electrode portions of the first substrate to the plurality of electrode portions of the second substrate. The supporting members supporting the first substrate and the second substrate are disposed on a location where resonance caused by ultrasonic oscillation externally supplied is restrained in the state where the first substrate is connected to the second substrate. The supporting members prevent irregular oscillation and resonance caused by the ultrasonic oscillation.
公开/授权文献
- US20030057537A1 Semiconductor device 公开/授权日:2003-03-27