发明授权
- 专利标题： Wafer drying apparatus
- 专利标题（中）： 晶圆烘干设备
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申请号： US10183813申请日： 2002-06-26
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公开(公告)号： US06757989B2公开(公告)日： 2004-07-06
- 发明人: Jeong-Yong Bae , Chang-Ro Yoon , Pyeng-Jae Park
- 申请人： Jeong-Yong Bae , Chang-Ro Yoon , Pyeng-Jae Park
- 优先权： KR2001-87114 20011228
- 主分类号： F26B1300
- IPC分类号： F26B1300
摘要：
An apparatus for drying a semiconductor substrate includes a chamber having a processing bath and a cover, a liquid flow system for supplying a liquid flow into the processing bath so as to clean the substrate and for draining a liquid from the processing bath, a gas distributor for spraying a gas for drying the substrate, and decompression means for exhausting air in the chamber.
公开/授权文献
- US20030121173A1 Wafer drying apparatus 公开/授权日：2003-07-03
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