Invention Grant
- Patent Title: Steam pressure reducing and conditioning system
- Patent Title (中): 蒸汽减压和调节系统
-
Application No.: US10039343Application Date: 2002-01-04
-
Publication No.: US06758232B2Publication Date: 2004-07-06
- Inventor: Hiroyuki Higuchi
- Applicant: Hiroyuki Higuchi
- Main IPC: B01D4700
- IPC: B01D4700

Abstract:
A steam conditioning system including a steam conditioning valve 1 for depressurizing and desuperheating steam S by supplying moisture W in the conditioning valve. A discharge pipe 3 connected to the steam conditioning valve 1 has a horizontal section 3a, and the horizontal arrangement section 3a is provided with a moisture drain 4 or at a portion near the bottom. Condensed moisture W1 is extracted from this moisture drain 4 and is recycled as moisture W to be supplied to the steam S in the conditioning valve 1. The steam conditioning valve 1 further has a reduced annular section 9 with a nozzle 5a disposed therein for injecting subcooled water mist W. A transport conduit 5 connects the drain 4 to nozzle 5a. Moisture W is drawn into steam flow S due to the Venturi effect caused by the pressure drop through the reduced annular section 9.
Public/Granted literature
- US20020092483A1 Steam pressure reducing and conditioning system Public/Granted day:2002-07-18
Information query