Invention Grant
- Patent Title: Method for fabricating Al-Si alloy packaging material
- Patent Title (中): 制造Al-Si合金包装材料的方法
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Application No.: US10285465Application Date: 2002-11-01
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Publication No.: US06759269B2Publication Date: 2004-07-06
- Inventor: Hyun-Kwang Seok , Jae-Chul Lee , Ho-In Lee , Jin-Kook Yoon , Ji-Young Byun
- Applicant: Hyun-Kwang Seok , Jae-Chul Lee , Ho-In Lee , Jin-Kook Yoon , Ji-Young Byun
- Priority: KR67891 20011101
- Main IPC: H01L2144
- IPC: H01L2144
Abstract:
In a method for fabricating a Si—Al alloy packaging material, by adding Al—Si alloy powders to Si powders and pressurizing-forming it, or by pressurizing-filling Si powders or a preforming body of Si powders with Al—Si alloy melt, a Si—Al alloy packaging material having good characteristics can be obtained.
Public/Granted literature
- US20030129786A1 Method for fabricating Si-Al alloy packaging material Public/Granted day:2003-07-10
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