发明授权
- 专利标题: Distributive capacitor for high density applications
- 专利标题(中): 分布式电容器用于高密度应用
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申请号: US10331901申请日: 2002-12-30
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公开(公告)号: US06760208B1公开(公告)日: 2004-07-06
- 发明人: Thomas D. Nagode , Gregory Redmond Black
- 申请人: Thomas D. Nagode , Gregory Redmond Black
- 主分类号: H02H700
- IPC分类号: H02H700
摘要:
A distributive capacitor 205 and impedance matching network 201 and transmitter 101 that use the capacitor and are suitable for high density integration applications include a printed circuit substrate 303 comprising one of a printed circuit board and a silicon based substrate, a first conductive layer 305 disposed on the printed circuit substrate, a layer of dielectric material 307 disposed on the first conductive layer and having a thickness, the dielectric material having a dielectric constant more than five times greater than the dielectric constant of the printed circuit substrate; and a second conductive layer 309 disposed on the layer of dielectric material and having a second length 311 and a second width 603 that are selected so that the distributive capacitor operates as a transmission line.
公开/授权文献
- US20040125526A1 DISTRIBUTIVE CAPACITOR FOR HIGH DENSITY APPLICATIONS 公开/授权日:2004-07-01