发明授权
- 专利标题: Heat conductive mold and manufacturing method thereof
- 专利标题(中): 导热模具及其制造方法
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申请号: US10370301申请日: 2003-02-18
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公开(公告)号: US06761842B2公开(公告)日: 2004-07-13
- 发明人: Masayuki Tobita , Shinya Tateda , Tsunehisa Kimura , Masahumi Yamato
- 申请人: Masayuki Tobita , Shinya Tateda , Tsunehisa Kimura , Masahumi Yamato
- 优先权: JP11-358646 19991217
- 主分类号: B29C3508
- IPC分类号: B29C3508
摘要:
A method of manufacturing a heat conductive molded part having determined heat conductivity properties is provided. The method includes providing a polymer composition containing boron nitride powder. A magnetic field is impressed to the polymer composition containing boron nitride powder, field orienting the boron nitride powder in the polymer composition to a fixed direction. The polymer composition is set containing boron nitride powder with the boron nitride powder oriented in the polymer composition to the fixed direction. The polymer composition may also be provided containing a solvent. The solvent is removed after field orienting the boron nitride powder in the polymer composition to the fixed direction The composition is then set with the field oriented boron nitride powder after having removed the solvent.
公开/授权文献
- US20030153665A1 Heat conductive mold and manufacturing method thereof 公开/授权日:2003-08-14
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