发明授权
US06761975B1 Polycarbosilane adhesion promoters for low dielectric constant polymeric materials
失效
用于低介电常数聚合物材料的聚碳硅烷粘合促进剂
- 专利标题： Polycarbosilane adhesion promoters for low dielectric constant polymeric materials
- 专利标题（中）： 用于低介电常数聚合物材料的聚碳硅烷粘合促进剂
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申请号： US09471299申请日： 1999-12-23
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公开(公告)号： US06761975B1公开(公告)日： 2004-07-13
- 发明人: Tian-An Chen , Anna M. George , Kreistler S. Y. Lau , Hui-Jung Wu
- 申请人： Tian-An Chen , Anna M. George , Kreistler S. Y. Lau , Hui-Jung Wu
- 主分类号： C08G7700
- IPC分类号： C08G7700
摘要：
The adhesion of low k poly(arylene ether) dielectric coating compositions is effectively enhanced by a polycarbosilane promoter additive or primer. A coating composition is prepared by (a) providing a poly(arylene ether) composition; and (b) adding to said composition a small effective adhesion promoting amount of certain polycarbosilanes. The adhesion enhanced coating compositions are cured by heat treatment at temperatures in excess of 50° C. to form a polycarbosilane-modified poly(arylene ether) polymer composition having a low k dielectric constant for use in semiconductor devices.
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