利索-全球专利检索

  1. 登录
  2. 注册
发明授权
US06762796B1 Image pickup module having integrated lens and semiconductor chip 有权
具有集成透镜和半导体芯片的摄像模块

  • 专利标题： Image pickup module having integrated lens and semiconductor chip
  • 专利标题（中）： 具有集成透镜和半导体芯片的摄像模块
  • 申请号： US09368445
    申请日： 1999-08-04
  • 公开(公告)号： US06762796B1
    公开(公告)日： 2004-07-13
  • 发明人: Yasuo Nakajoh , Yutaka Yunoki
  • 申请人： Yasuo Nakajoh , Yutaka Yunoki
  • 优先权： JP10-225956 19980810
  • 主分类号： H04N5225
  • IPC分类号： H04N5225
Image pickup module having integrated lens and semiconductor chip
摘要：
An image pick-up module of the present invention is such that, on one surface of the substrate 2, a positioning reference surface P constituted of an equally flattened surface is defined, the positioning reference surface P includes a semiconductor chip positioning surface portion, a frame member mounting surface portion at which a frame member 10 is joined and mounted, and a mirror frame positioning reference surface portion at which a mirror frame position 21 is joined upon being mounted and positioned, in which the semiconductor chip 1 and lens frame member are positioned on the positioning reference surface constituted of the equally flattened surface defined on the one surface of the substrate while using the reference surface portion at which at the semiconductor chip 1 is joined and positioned and reference surface portion at which the lens frame member is joined and positioned.
摘要（中）：

本发明的图像拾取模块是这样的：在基板2的一个表面上，限定由平坦的平坦表面构成的定位基准表面P，定位基准表面P包括半导体芯片定位表面部分 框架构件10被接合并安装的框架构件安装表面部分和安装和定位镜框架位置21的镜框定位基准表面部分，其中半导体芯片1和透镜框架构件是 定位在由在半导体芯片1被接合并定位的基准面部分和基板表面部分之间限定在基板的一个表面上的同平坦化表面构成的定位参考表面上，其中透镜框架构件与基板表面部分接合， 定位。

信息查询
Espacenet
0/0