发明授权
US06764912B1 Passivation of nitride spacer 有权
氮化物间隔物钝化

Passivation of nitride spacer
摘要:
The formation of metal silicides in silicon nitride spacers on a gate electrode causes bridging between a gate electrode and the source and drain regions of a semiconductor device. The bridging is prevented by forming a thin layer of silicon oxide on the silicon nitride spacers prior to forming the metal silicide layers on the device.
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