发明授权
US06765289B2 Reinforcement material for silicon wafer and process for producing IC chip using said material
失效
用于硅晶片的增强材料和使用所述材料制造IC芯片的工艺
- 专利标题： Reinforcement material for silicon wafer and process for producing IC chip using said material
- 专利标题（中）： 用于硅晶片的增强材料和使用所述材料制造IC芯片的工艺
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申请号： US09840864申请日： 2001-04-25
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公开(公告)号： US06765289B2公开(公告)日： 2004-07-20
- 发明人: Yasukazu Nakata , Yuichi Iwakata , Takeshi Kondo , Hideo Senoo
- 申请人： Yasukazu Nakata , Yuichi Iwakata , Takeshi Kondo , Hideo Senoo
- 优先权： JP2000-126609 20000426; JP2001-124757 20010423
- 主分类号： H01L2314
- IPC分类号： H01L2314
摘要：
Reinforcing material having Rockwell hardness of 60 or above and comprising base material and adhesive is formed, and then the reinforcing material is attached to one side of silicon wafer on which circuits are not formed prior to dicing.