The present invention aims to provide an adhesive composition showing high adhesion and cohesion as well as good heat resistance. Adhesive compositions of the present invention include an imide (meth)acrylate, a monomer having a glass transition temperature of −50° C. or less when it is homopolymerized, and a photoinitiator, wherein the content of the imide (meth)acrylate is 1-20 parts by weight per 100 parts by weight of the monomer.