The present invention relates to a high speed embossing and adhesive printing process, said process comprising the steps of (a) applying an adhesive to a conformable heated glue application roll; (b) applying said adhesive to a first patterned embossing roll, having an outer surface, which is engaged with a second patterned embossing roll having a complementary pattern to said first embossing roll; (c) passing a web of sheet material between said first and second embossing rolls at a tangential line speed to simultaneously emboss said web and apply said adhesive to said web, such that said adhesive forms an adhesive pattern between embossments; and (d) applying a renewable release agent to the outer surface of the first patterned embossing roll.