发明授权
- 专利标题: Flip-chip assembly with thin underfill and thick solder mask
- 专利标题(中): 倒装芯片组合,底层填料厚,焊接面积较大
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申请号: US10402631申请日: 2003-03-28
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公开(公告)号: US06774497B1公开(公告)日: 2004-08-10
- 发明人: Jing Qi , Janice M. Danvir , Tomasz L. Klosowiak , Prasanna Kulkarni , Nadia Yala
- 申请人: Jing Qi , Janice M. Danvir , Tomasz L. Klosowiak , Prasanna Kulkarni , Nadia Yala
- 主分类号: H01L2348
- IPC分类号: H01L2348
摘要:
The invention provides a method for attaching a flip chip to an electrical substrate such as a printed wiring board. A bumped flip chip is provided, the flip chip including an active surface and a plurality of connective bumps extending from the active surface, each connective bump including a side region. A thin layer of an underfill material is applied to the active surface of the flip chip and to a portion of the side regions of the connective bumps. The flip chip is positioned on the electrical substrate, the electrical substrate including a thick layer of a solder mask disposed on the electrical substrate. The flip chip is heated to electrically connect the flip chip to the electrical substrate, wherein the underfill material and the solder mask combine to form a stress-relief layer when the flip chip is electrically connected to the electrical substrate.