Process of removing holefill residue from a metallic surface of an electronic substrate

Invention Grant

US06776852B2 Process of removing holefill residue from a metallic surface of an electronic substrate 失效

Title translation: 从电子基板的金属表面去除孔填充残渣的方法

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Patent Title: Process of removing holefill residue from a metallic surface of an electronic substrate
Patent Title (中): 从电子基板的金属表面去除孔填充残渣的方法
Application No.: US10046621

Application Date: 2002-01-14
Publication No.: US06776852B2

Publication Date: 2004-08-17
Inventor: Christina M. Boyko , Brian E. Curcio , Donald S. Farquhar , Michael Wozniak
Applicant: Christina M. Boyko , Brian E. Curcio , Donald S. Farquhar , Michael Wozniak
Main IPC: B08B300
IPC: B08B300

Process of removing holefill residue from a metallic surface of an electronic substrate

Abstract:

A process of removing excess holefill material from a surface of an electronic substrate in which the holefill residue is contacted with a swelling agent followed by planarizing of the surface in the presence of an agent no stronger than a liquid having a pH of about 6 to about 8.

Abstract(Chinese):

从电子基板的表面去除多余的孔填充材料的过程，其中孔填充残余物与溶胀剂接触，然后在不比pH大约6至大约6的液体的试剂存在下平坦化表面 8。

Public/Granted literature

US20030131870A1 Process of removing holefill residue from a metallic surface of an electronic substrate Public/Granted day:2003-07-17

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