发明授权
- 专利标题: Manufacturing method of Schottky barrier diode
- 专利标题(中): 肖特基势垒二极管的制造方法
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申请号: US10205605申请日: 2002-07-26
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公开(公告)号: US06777277B2公开(公告)日: 2004-08-17
- 发明人: Tetsuro Asano , Katsuaki Onoda , Yoshibumi Nakajima , Shigeyuki Murai , Hisaaki Tominaga , Koichi Hirata , Mikito Sakakibara , Hidetoshi Ishihara
- 申请人: Tetsuro Asano , Katsuaki Onoda , Yoshibumi Nakajima , Shigeyuki Murai , Hisaaki Tominaga , Koichi Hirata , Mikito Sakakibara , Hidetoshi Ishihara
- 优先权: JP2001-290756 20010925
- 主分类号: H01L21338
- IPC分类号: H01L21338
摘要:
A Schottky barrier diode has a Schottky contact region formed in an n epitaxial layer disposed on a GaAs substrate and an ohmic electrode surrounding the Schottky contact region. The ohmic electrode is disposed directly on an impurity-implanted region formed on the substrate. An insulating region is formed through the n epitaxial layer so that an anode bonding pad is isolated form other elements of the device at a cathode voltage. The planar configuration of this device does not include the conventional polyimide layer, and thus has a better high frequency characteristics than conventional devices.
公开/授权文献
- US20030060031A1 Manufacturing method of schottky barrier diode 公开/授权日:2003-03-27
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