发明授权
- 专利标题： Electrostatic chucking system, and apparatus and method of manufacturing a semiconductor device using the electrostatic chucking system
- 专利标题（中）： 静电夹持系统以及使用静电吸盘系统制造半导体器件的装置和方法
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申请号： US09732891申请日： 2000-12-11
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公开(公告)号： US06778377B2公开(公告)日： 2004-08-17
- 发明人: Kimio Hagi
- 申请人： Kimio Hagi
- 优先权： JP2000-188382 20000622
- 主分类号： H01T2300
- IPC分类号： H01T2300
摘要：
A voltage is applied to an electrode of an electrostatic chuck for chucking a semiconductor substrate, and the application voltage is controlled stepwise by means of a voltage control section. In the electrostatic chucking system, a temperature sensor may be provided for detecting the temperature of the semiconductor substrate held by the electrostatic chuck, wherein a signal output from the temperature sensor is input to the voltage control section to thereby control the applied voltage.
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