发明授权
- 专利标题: Method of fabricating polysilicon thin film transistor
- 专利标题(中): 制造多晶硅薄膜晶体管的方法
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申请号: US10310966申请日: 2002-12-06
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公开(公告)号: US06780693B2公开(公告)日: 2004-08-24
- 发明人: Hyun-Sik Seo , Binn Kim , Jong-Uk Bae
- 申请人: Hyun-Sik Seo , Binn Kim , Jong-Uk Bae
- 优先权: KR2001-87728 20011229; KR2001-87729 20011229; KR2001-87730 20011229; KR2001-87731 20011229
- 主分类号: H01L2184
- IPC分类号: H01L2184
摘要:
A method of forming a polycrystalline silicon active layer for use in a thin film transistor is provided. The method includes forming a buffer layer over a substrate, forming an amorphous silicon layer over the buffer layer, applying a catalytic metal to a surface of the amorphous silicon layer, crystallizing the amorphous silicon layer having the catalytic metal thereon into a polycrystalline silicon layer, forming an island pattern on the polycrystalline silicon layer, thereby defining an active region underneath in the polycrystalline silicon layer, applying n-type ions to the polycrystalline silicon layer and then heat-treating the polycrystalline silicon layer to remove the catalytic metal from the active region underneath the island pattern, patterning the polycrystalline silicon layer using the island pattern as a mask to form an active layer, doping a small amount of p-type ions into the active layer to adjust a threshold voltage of the then film transistor to be formed using the active layer, and removing the island pattern from the active layer.
公开/授权文献
- US20040126938A1 Method of fabricating polysilicon thin film transistor 公开/授权日:2004-07-01
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