Invention Grant
- Patent Title: Diamond film depositing apparatus and method thereof
- Patent Title (中): 金刚石膜沉积设备及其方法
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Application No.: US10122459Application Date: 2002-04-15
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Publication No.: US06786176B2Publication Date: 2004-09-07
- Inventor: Wook-Seong Lee , Young Joon Baik , Kwang Yong Eun
- Applicant: Wook-Seong Lee , Young Joon Baik , Kwang Yong Eun
- Priority: KR1999/11854 19991027
- Main IPC: C23C1600
- IPC: C23C1600

Abstract:
A diamond film depositing apparatus and method are disclosed in which a uniform and large plasma is formed on a substrate having a diameter of larger than 100 mm without using a heated filament cathode, without applying a magnetic field thereto, and without using a ballast resistance. The thusly formed plasma is maintained stably for a long time, so that a diamond thick film having a diameter of larger than 4 inches and a thickness of over hundreds of &mgr;m can be deposited on a flat or curved substrate and also on a Si wafer.
Public/Granted literature
- US20020110648A1 Diamond film depositing apparatus and method thereof Public/Granted day:2002-08-15
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