- 专利标题: Determining method of thermal processing condition
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申请号: US10333585申请日: 2003-01-24
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公开(公告)号: US06787377B2公开(公告)日: 2004-09-07
- 发明人: Wenling Wang , Koichi Sakamoto , Fujio Suzuki , Moyuru Yasuhara
- 申请人: Wenling Wang , Koichi Sakamoto , Fujio Suzuki , Moyuru Yasuhara
- 优先权: JP2000-224146 20000725; JP2000-224147 20000725
- 主分类号: G01R3126
- IPC分类号: G01R3126
摘要:
The invention is a method of determining a set temperature profile for a method of controlling respective substrate temperatures of a plurality of groups in accordance with respective corresponding set temperature profiles, in a method of heat processing a plurality of substrates that are classified into the plurality of groups. The invention includes a first heat processing step of controlling respective substrate temperatures of a plurality of groups in accordance with respective predetermined provisional set temperature profiles for first-batch substrates that are classified into the plurality of groups, and of introducing a process gas to conduct a heat process to form films on the substrates; a first film-thickness measuring step of measuring a thickness of the films formed on the substrates; and a first set-temperature-profile amending step of respectively amending the provisional set temperature profiles based on the measured thickness, in such a manner that a thickness of films formed during a heat process is substantially the same between the plurality of groups. In the first heat processing step, the provisional set temperature profiles are profiles whose set temperatures change as time passes.
公开/授权文献
- US20030109071A1 Method of determining heat treatment conditions 公开/授权日:2003-06-12
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