发明授权
US06787866B2 Semiconductor device having a moveable member therein and a protective member disposed thereon
有权
其中具有可移动构件的半导体装置和设置在其上的保护构件
- 专利标题： Semiconductor device having a moveable member therein and a protective member disposed thereon
- 专利标题（中）： 其中具有可移动构件的半导体装置和设置在其上的保护构件
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申请号： US10091497申请日： 2002-03-07
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公开(公告)号： US06787866B2公开(公告)日： 2004-09-07
- 发明人: Tetsuo Fujii , Tsuyoshi Fukada , Kenichi Ao
- 申请人： Tetsuo Fujii , Tsuyoshi Fukada , Kenichi Ao
- 优先权： JP11-76566 19990319; JP11-196345 19990709
- 主分类号： H01L2984
- IPC分类号： H01L2984
摘要：
A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the jig is detached from the protective sheet and the semiconductor wafer bonded together. After that, the semiconductor wafer is cut into semiconductor chips by dicing along the grooves of the protective sheet. Because the protective sheet is not cut by dicing, no scraps of the protective sheet is produced, thereby preventing contamination to the chips.