发明授权
US06788853B2 Method for cleaving integrated optic waveguides to provide a smooth waveguide endface 失效
用于切割集成光波导以提供光滑波导端面的方法

  • 专利标题: Method for cleaving integrated optic waveguides to provide a smooth waveguide endface
  • 专利标题(中): 用于切割集成光波导以提供光滑波导端面的方法
  • 申请号: US09878486
    申请日: 2001-06-11
  • 公开(公告)号: US06788853B2
    公开(公告)日: 2004-09-07
  • 发明人: Dan A. SteinbergMindaugas F. Dautartas
  • 申请人: Dan A. SteinbergMindaugas F. Dautartas
  • 主分类号: G02B630
  • IPC分类号: G02B630
Method for cleaving integrated optic waveguides to provide a smooth waveguide endface
摘要:
In an integrated optical waveguide device including a first top portion on the substrate, and a plurality of juxtaposed waveguide cores within cladding layers on a second top portion of the substrate, the waveguide cores having respective inner endfaces parallel to a longitudinal open slotway formed in the substrate between the first and second top portions, the substrate being undercut from the slotway to produce a cantilevered section of the waveguide cores and cladding layers, for permitting the plurality of waveguide cores and associated cladding layers to be simultaneously cleaved, thereby providing a smooth endface thereacross.
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