发明授权
US06790737B2 Method for fabricating thin metal layers from the liquid phase 失效
从液相制造薄金属层的方法

Method for fabricating thin metal layers from the liquid phase
摘要:
A method for producing metal layers on surfaces of semiconductor substrates includes the step of providing a semiconductor substrate having a surface. In this case, a precursor compound of a metal to be deposited is condensed out on the semiconductor surface and subsequently decomposed thermally. The method makes it possible to fill trenches with a high aspect ratio, it being possible to effectively suppress the formation of voids.
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