Invention Grant
- Patent Title: Integrated cobalt silicide process for semiconductor devices
- Patent Title (中): 用于半导体器件的集成硅化钴工艺
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Application No.: US09748965Application Date: 2000-12-27
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Publication No.: US06793735B2Publication Date: 2004-09-21
- Inventor: Marc W. Cantell , Jerome B. Lasky , Ronald J. Line , William J. Murphy , Kirk D. Peterson , Prabhat Tiwari
- Applicant: Marc W. Cantell , Jerome B. Lasky , Ronald J. Line , William J. Murphy , Kirk D. Peterson , Prabhat Tiwari
- Main IPC: C23C1600
- IPC: C23C1600

Abstract:
A method and apparatus are provided for forming a silicide on a semiconductor substrate by integrating under a constant vacuum the processes of removing an oxide from a surface of a semiconductor substrate and depositing a metal on the cleaned surface without exposing the cleaned surface to air. The method and apparatus of the present invention eliminates the exposure of the cleaned substrate to air between the oxide removal and metal deposition steps. This in-situ cleaning of the silicon substrate prior to cobalt deposition provides a cleaner silicon substrate surface, resulting in enhanced formation of cobalt silicide when the cobalt layer is annealed.
Public/Granted literature
- US20010001298A1 Integrated cobalt silicide process for semiconductor devices Public/Granted day:2001-05-17
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