A cover-lay film comprising a heat-resistant film and an adhesive layer, wherein the adhesive layer is formed of an epoxy resin composition containing (a) an epoxy resin, (b) a curing agent, (c) a phenolic hydroxyl-containing polyamide-poly(butadiene-acrylonitrile) copolymer, and (d) an ion capturing agent and having a glass transition temperature of 80° C. or higher after cure, and the heat-resistant film mainly comprises a polyimide containing a 3,3′,4,4′-biphenyltetracarboxylic acid component and a p-phenylenediamine component and has a specific coefficient of linear thermal expansion and a specific tensile modulus in both machine and transverse directions.