- 专利标题: Performance evaluation method for plasma processing apparatus for continuously maintaining a desired performance level
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申请号: US09957684申请日: 2001-09-20
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公开(公告)号: US06795796B2公开(公告)日: 2004-09-21
- 发明人: Akira Nakano , Tadahiro Ohmi
- 申请人: Akira Nakano , Tadahiro Ohmi
- 优先权: JP2000-295086 20000927
- 主分类号: G06F1900
- IPC分类号: G06F1900
摘要:
The performance of a plasma processing apparatus which is disassembled, transferred, and reassembled is evaluated. The plasma processing apparatus has a plasma processing chamber having an electrode for exciting a plasma, a radiofrequency generator connected to the electrode, and an impedance matching circuit for performing the impedance matching between the plasma processing chamber and the radiofrequency generator. The performance of the apparatus is evaluated whether or not three times the first series resonant frequency of the plasma processing chamber is larger than the power frequency supplied to the plasma processing chamber.