An electrodepositing solution for low-potential electrodeposition is disclosed which is used in an electrodeposition method and a photoelectrodeposition method and which can improve the film formability under the application of a low voltage, suppress the elution of metal ions and stably form by deposition an electrodeposition film having a uniform thickness, a uniform color density and a smooth surface. The electrodepositing solution permits an electrodeposition film of an electrodeposition material to be formed by deposition on a conductive material upon application of a voltage between the conductive material and a counter electrode. The electrodeposition material contains an electropositive polymer material which contains, as at least one component thereof, a copolymer consisting of a hydrophobic monomer, a hydrophilic monomer and a plastic monomer.