A calibrated, low-profile magnetic sensor and method for forming such a sensor are described herein. Generally, a magnetic sensing device is formed within a housing, wherein the magnetic sensing device comprises at least one magnet. The magnetic sensor includes a compact integrated circuit package such as, for example, a small outline integrated circuit package (SOIC). A magnetic sensing element is generally mounted to the compact integrated circuit package. The magnetic sensing device can be configured to additionally incorporate a printed circuit board (PCB) having a hole formed therein such that the compact integrated circuit package can be surface mounted off-center on the printed circuit board, so that the hole can be located within the printed circuit board to match a shape of the magnet, allowing the magnet to pass through the circuit board adjacent to the SOIC to complete the magnetic circuit. An orifice placed with in the housing permits a tool to be passed through the orifice within the housing to contact the magnet. The magnet can be placed in the optimum position for calibration of the magnetic circuit thereof. The same orifice that is used for calibrating the position of the magnet can also be utilized as an injection port for encapsulating the device using an injection epoxy dispensing process.