Invention Grant
- Patent Title: Hot swap circuit module
- Patent Title (中): 热插拔电路模块
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Application No.: US10128229Application Date: 2002-04-24
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Publication No.: US06801973B2Publication Date: 2004-10-05
- Inventor: Chung-Kai Wu
- Applicant: Chung-Kai Wu
- Main IPC: G06F1300
- IPC: G06F1300

Abstract:
A hot swap circuit module for a switch system having a backplane. The module includes a circuit board and a latch circuit. The circuit board has a plurality of pins for inserting into the backplane. The latch, disposed on the circuit board, has a data input terminal for receiving an important signal, and a control terminal for receiving a clock signal to latch the important signal. The latch circuit is utilized to eliminate malfunction resulting from the disturbance voltage caused by hot swapping. Any circuit with latch function is allowed to be applied to the switch system of the present invention such that the switch system operates more stably without special pins or additional bus controller.
Public/Granted literature
- US20030204658A1 Hot swap circuit module Public/Granted day:2003-10-30
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