发明授权
- 专利标题: Semiconductor package including flip chip
- 专利标题(中): 半导体封装包括倒装芯片
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申请号: US10034656申请日: 2001-12-26
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公开(公告)号: US06803645B2公开(公告)日: 2004-10-12
- 发明人: Jong Sik Paek
- 申请人: Jong Sik Paek
- 优先权: KR2000-86246 20001229
- 主分类号: H01L23495
- IPC分类号: H01L23495
摘要:
A semiconductor package comprising a plurality of leads. Each of the leads defines opposed first and second surfaces. Also included in the semiconductor package is a semiconductor chip which defines opposed first and second surfaces, and includes a plurality of input/output pads disposed on the first surface thereof. A plurality of conductive bumps are used to electrically connect the input/output pads of the semiconductor package to the second surfaces of respective ones of the leads. An encapsulant portion of the semiconductor package covers the semiconductor chip, the conductive bumps, and the second surfaces of the leads such that at least portions of the first surfaces of the leads are exposed within the encapsulant portion.
公开/授权文献
- US20020084534A1 Semiconductor package including flip chip 公开/授权日:2002-07-04
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