发明授权
US06803668B2 Process-robust alignment mark structure for semiconductor wafers
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用于半导体晶片的工艺稳健的对准标记结构
- 专利标题： Process-robust alignment mark structure for semiconductor wafers
- 专利标题（中）： 用于半导体晶片的工艺稳健的对准标记结构
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申请号： US10303501申请日： 2002-11-22
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公开(公告)号： US06803668B2公开(公告)日： 2004-10-12
- 发明人: Karen L. Holloway , Andrew Lu , Qiang Wu
- 申请人： Karen L. Holloway , Andrew Lu , Qiang Wu
- 主分类号： H01L23544
- IPC分类号： H01L23544
摘要：
An alignment mark structure for use upon a semiconductor substrate is disclosed. In an exemplary embodiment, the alignment mark structure includes a plurality of segments arranged in an alignment pattern, with each of the plurality of segments being formed from a base pattern created on the substrate. The base pattern includes a plurality of sizes, wherein each of the plurality of sizes of the base pattern is repeated throughout an entire length of each of the plurality of segments.
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