Invention Grant
- Patent Title: Z interconnect structure and method
- Patent Title (中): Z互连结构和方法
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Application No.: US10041261Application Date: 2002-01-08
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Publication No.: US06805280B2Publication Date: 2004-10-19
- Inventor: Lisa J. Jimarez , Mark V. Pierson
- Applicant: Lisa J. Jimarez , Mark V. Pierson
- Main IPC: B23K120
- IPC: B23K120

Abstract:
The current invention provides a method of attaching a plurality of cores wherein a core has a via with a conductive surface to be electrically connected to a conductive surface on another core. The method provides for applying a metallurgical paste to a conductive surface, removing a portion of the flux from the paste and joining the two cores. The current invention also provides a structure including a plurality of cores wherein a metallurgical paste electrically connects a via with a conductive surface on a core to a conductive surface on another core.
Public/Granted literature
- US20030127247A1 Z interconnect structure and method Public/Granted day:2003-07-10
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