发明授权
- 专利标题： Z interconnect structure and method
- 专利标题（中）： Z互连结构和方法
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申请号： US10041261申请日： 2002-01-08
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公开(公告)号： US06805280B2公开(公告)日： 2004-10-19
- 发明人: Lisa J. Jimarez , Mark V. Pierson
- 申请人： Lisa J. Jimarez , Mark V. Pierson
- 主分类号： B23K120
- IPC分类号： B23K120
摘要：
The current invention provides a method of attaching a plurality of cores wherein a core has a via with a conductive surface to be electrically connected to a conductive surface on another core. The method provides for applying a metallurgical paste to a conductive surface, removing a portion of the flux from the paste and joining the two cores. The current invention also provides a structure including a plurality of cores wherein a metallurgical paste electrically connects a via with a conductive surface on a core to a conductive surface on another core.
公开/授权文献
- US20030127247A1 Z interconnect structure and method 公开/授权日：2003-07-10